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Flip chip bonder and bga-rework equipment - FINETECH GmbH & Co. KG

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About FINETECH GmbH & Co. KG

FINETECH bietet innovative Lösungen für alle SMD Reparatur und Mikromontagefälle. Flexible modular aufgebaute Reparaturstationen und Bonder sind in manueller, semiautomatischer und automatischer Konfiguration erhältlich.

 
Postal address: 
*FINETECH GmbH & Co. KG
z. hp Mr. Matthias Gruner
Wolfener Str. 32/34
12681 Berlin
Germany • Berlin • Marzahn-Hellersdorf
*To the starting map and route planning
 
Information how to contact us:
*Phone: + 49 30-936681303
*Mobile: + 49 171 333 57 53
*Mail: Email us today
*Website: http://www.finetech.de
 
Industry allocations:
*Machines & plants • Machine construction & mechanics
*Manufacturing • Electrotechnology & electronics
*Manufacturing • Glass & optics
 
Product- / search words:
acf bondingadhesive equipment manufactureradvanced packagingbga assemblybga packagebga repairbga reworkbonderbondersbondingbonding chip
 
Partnersite: www.axxus.de
 
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